Inspection

Automated optical inspection systems deliver reliable and repeatable results ensuring that our manufactured products proceed to the next stage defect free. Those assemblies that cannot be inspected under AOI are manually inspected by one of our experienced team of trained Inspectors.

Defect categories that can be identified through AOI:

• Polarity
• Extra Part
• Misplaced
• Wrong Part Size
• Excess
• Bridging
• Tombstone
• Misalignment
• Missing Component
• Dry Joint
• Short-circuit

X-Ray is the proven industry standard process for identifying any structural defects in solder joints. We utilise our X-Ray system to examine high density joints on fine pitch components and hidden joints on any devices such as BGAs (Ball Grid Array). We also inspect for structural defects in solder ball joints which if not captured can lead to voiding that can result in long-term field failure. Investing in X-Ray technology means Dynamic EMS is well positioned to cope with technologies now and in the future.

Defect categories that can be identified through X-Ray:

• Insufficient
• Excess
• Shorts
• Marginal Joints
• Voids
• Bridging

PCBAs and electronic assemblies that cannot be inspected using our AOI system are examined by our professionally trained team of Manual Inspectors.  Working to IPC-610 Class 3 and using their skills and experience gained over many years, we aim to minimise the opportunity for error and maximise inspection coverage.